Images are for reference only. See Product Specifications for product details
Kycon, Inc. K86X-AA-26P-KJ30
HD26 MALE SOLDER CUP FORMED-W/BU
- Manufacturer
- Kycon, Inc.
- Datasheet
- Price
- 4.72
- Stock
- 0
Product Details
- Color
- -
- Flange Feature
- Board Side (M3)
- Contact Finish Thickness
- 30.0µin (0.76µm)
- Series
- DP
- Number of Rows
- 2
- Material Flammability Rating
- UL94 V-0
- Features
- Board Lock, Grounding Indents
- Voltage Rating
- 300V
- Shell Size, Connector Layout
- 2 (DA, A)
- Packaging
- Bulk
- Backset Spacing
- 0.406" (10.30mm)
- Wire Gauge
- -
- Connector Style
- D-Sub
- Part Status
- Active
- Contact Material
- Copper Alloy
- Termination
- Solder
- Ingress Protection
- -
- Contact Form
- -
- Dielectric Material
- Thermoplastic
- Contact Type
- Signal
- Number of Positions
- 15
- Mounting Type
- Through Hole, Right Angle
- Current Rating (Amps)
- 7.5A
- Connector Type
- Plug, Male Pins
- Operating Temperature
- -55°C ~ 125°C
- Contact Finish
- Gold, GXT™
- Shell Material, Finish
- Steel, Tin Plated