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JAE Electronics FI-XPB30SRL-HF11-R3000
CONN RCPT 30P 0.039 GOLD SMD R/A
- Manufacturer
- JAE Electronics
- Datasheet
- Price
- 0
- Stock
- 0
Product Details
- Applications
- -
- Ingress Protection
- -
- Contact Finish Thickness - Post
- 1.25µin (0.032µm)
- Contact Type
- Non-Gendered
- Insulation Material
- Plastic
- Contact Finish Thickness - Mating
- 3.90µin (0.099µm)
- Contact Shape
- -
- Number of Positions
- 30
- Mounting Type
- Surface Mount, Right Angle
- Row Spacing - Mating
- -
- Connector Type
- Receptacle
- Contact Finish - Post
- Gold
- Fastening Type
- Friction Lock
- Contact Length - Post
- -
- Style
- Board to Cable/Wire
- Number of Rows
- 1
- Current Rating (Amps)
- -
- Series
- FI-JH
- Pitch - Mating
- 0.016" (0.40mm)
- Operating Temperature
- -
- Features
- Solder Retention
- Voltage Rating
- -
- Mated Stacking Heights
- -
- Packaging
- Tape & Reel (TR)
- Contact Material
- Copper Alloy
- Contact Finish - Mating
- Gold
- Part Status
- Obsolete
- Insulation Color
- -
- Number of Positions Loaded
- All
- Termination
- Solder
- Insulation Height
- 0.039" (1.00mm)
- Material Flammability Rating
- -