Images are for reference only. See Product Specifications for product details
JAE Electronics FI-XB30S-HF10-NPB
CONN RCPT 30P 0.039 GOLD SMD R/A
- Manufacturer
- JAE Electronics
- Datasheet
- Price
- 0
- Stock
- 0
Product Details
- Style
- Board to Cable/Wire
- Number of Rows
- 1
- Current Rating (Amps)
- 1A per Contact
- Series
- FI-E
- Pitch - Mating
- 0.039" (1.00mm)
- Operating Temperature
- -40°C ~ 80°C
- Features
- Ground Plate, Solder Retention
- Voltage Rating
- 200V
- Mated Stacking Heights
- -
- Packaging
- Cut Tape (CT)
- Contact Material
- Copper Alloy
- Contact Finish - Mating
- Gold
- Part Status
- Obsolete
- Insulation Color
- -
- Number of Positions Loaded
- All
- Termination
- Solder
- Insulation Height
- 0.126" (3.20mm)
- Material Flammability Rating
- UL94 V-0
- Applications
- General Purpose
- Ingress Protection
- -
- Contact Finish Thickness - Post
- -
- Contact Type
- Non-Gendered
- Insulation Material
- Plastic
- Contact Finish Thickness - Mating
- -
- Contact Shape
- -
- Number of Positions
- 14
- Mounting Type
- Surface Mount, Right Angle
- Row Spacing - Mating
- -
- Connector Type
- Receptacle
- Contact Finish - Post
- Tin
- Fastening Type
- Latch Holder
- Contact Length - Post
- -