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JAE Electronics FI-TD50SB-E
CONN RCPT 50POS 0.05 GOLD SMD
- Manufacturer
- JAE Electronics
- Datasheet
- Price
- 0
- Stock
- 0
Product Details
- Style
- Board to Cable/Wire
- Number of Rows
- 1
- Current Rating (Amps)
- -
- Series
- FI-XP
- Pitch - Mating
- 0.039" (1.00mm)
- Operating Temperature
- -
- Features
- Grounding Pins, Shielded, Solder Retention
- Voltage Rating
- -
- Mated Stacking Heights
- -
- Packaging
- Bulk
- Contact Material
- Copper Alloy
- Contact Finish - Mating
- Gold
- Part Status
- Obsolete
- Insulation Color
- Beige
- Number of Positions Loaded
- All
- Termination
- Solder
- Insulation Height
- -
- Material Flammability Rating
- UL94 V-0
- Applications
- -
- Ingress Protection
- -
- Contact Finish Thickness - Post
- -
- Contact Type
- Non-Gendered
- Insulation Material
- Plastic
- Contact Finish Thickness - Mating
- 12.0µin (0.30µm)
- Contact Shape
- -
- Number of Positions
- 30
- Mounting Type
- Board Edge, Cutout; Bottom Mount, Surface Mount, Right Angle
- Row Spacing - Mating
- -
- Connector Type
- Receptacle
- Contact Finish - Post
- Tin
- Fastening Type
- Friction Lock
- Contact Length - Post
- -