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CUI, Inc. HSS-C2591-SMT-TR
HEAT SINK TO-263 COPPER
- Manufacturer
- CUI, Inc.
- Datasheet
- Price
- 0.6
- Stock
- 0
Product Details
- Material Finish
- Black Anodized
- Attachment Method
- PC Pin
- Thermal Resistance @ Natural
- 10.71°C/W
- Type
- Board Level, Vertical
- Height Off Base (Height of Fin)
- 0.500" (12.70mm)
- Shape
- Rectangular, Fins
- Power Dissipation @ Temperature Rise
- 7.0W @ 75°C
- Width
- 1.378" (35.00mm)
- Thermal Resistance @ Forced Air Flow
- 2.67°C/W @ 200 LFM
- Length
- 1.500" (38.10mm)
- Series
- HSE
- Diameter
- -
- Material
- Aluminum Alloy
- Part Status
- Active
- Package Cooled
- TO-220