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CUI, Inc. HSS-B20-NP-13
HEATSINK TO-220 3.9W ALUMINUM
- Manufacturer
- CUI, Inc.
- Datasheet
- Price
- 0.47
- Stock
- 0
Product Details
- Series
- 218
- Diameter
- -
- Material
- Copper
- Part Status
- Active
- Package Cooled
- SMD
- Material Finish
- Tin
- Attachment Method
- SMD Pad
- Thermal Resistance @ Natural
- 31.00°C/W
- Type
- Top Mount
- Height Off Base (Height of Fin)
- 0.400" (10.16mm)
- Shape
- Rectangular, Fins
- Power Dissipation @ Temperature Rise
- 2.3W @ 40°C
- Width
- 1.030" (26.16mm)
- Thermal Resistance @ Forced Air Flow
- 5.00°C/W @ 600 LFM
- Length
- 0.500" (12.70mm)