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CUI, Inc. HSE-B20630-040H-01

HEAT SINK, EXTRUSION, TO-220, 63

Manufacturer
CUI, Inc.
Datasheet
Price
0.76
Stock
0

Product Details

Part Status
Active
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Material Finish
Black Anodized
Attachment Method
Bolt On and PC Pin
Thermal Resistance @ Natural
9.00°C/W
Type
Top Mount
Height Off Base (Height of Fin)
0.500" (12.70mm)
Shape
Square, Fins
Power Dissipation @ Temperature Rise
-
Width
1.181" (30.00mm)
Thermal Resistance @ Forced Air Flow
-
Length
1.181" (30.00mm)
Series
-
Diameter
-
Material
Aluminum