Images are for reference only. See Product Specifications for product details
CUI, Inc. HSE-B18254-060H-W
HEAT SINK, EXTRUSION, TO-218, 25
- Manufacturer
- CUI, Inc.
- Datasheet
- Price
- 0.74
- Stock
- 0
Product Details
- Part Status
- Active
- Package Cooled
- Assorted (BGA, LGA, CPU, ASIC...)
- Material Finish
- Natural Anodized
- Attachment Method
- Thermal Tape, Adhesive (Included)
- Thermal Resistance @ Natural
- -
- Type
- Top Mount
- Height Off Base (Height of Fin)
- 0.394" (10.00mm)
- Shape
- Rectangular, Fins
- Power Dissipation @ Temperature Rise
- -
- Width
- 0.866" (22.00mm)
- Thermal Resistance @ Forced Air Flow
- -
- Length
- 1.378" (35.00mm)
- Series
- -
- Diameter
- -
- Material
- Aluminum Alloy