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Chip Quik, Inc. SMD291AX500T3C

SOLDER PASTE NO-CLEAN 63/37 T3 5

Manufacturer
Chip Quik, Inc.
Datasheet
Price
83.25
Stock
1

Product Details

Series
245
Process
Leaded
Diameter
0.031" (0.79mm)
Flux Type
No-Clean
Shelf Life
-
Wire Gauge
20 AWG, 22 SWG
Composition
Sn62Pb36Ag2 (62/36/2)
Part Status
Active
Melting Point
354°F (179°C)
Shipping Info
-
Form
Spool, 1 lb (454 g)
Shelf Life Start
-
Type
Wire Solder
Storage/Refrigeration Temperature
50°F ~ 104°F (10°C ~ 40°C)