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Chip Quik, Inc. SMD291AX500T3C
SOLDER PASTE NO-CLEAN 63/37 T3 5
- Manufacturer
- Chip Quik, Inc.
- Datasheet
- Price
- 83.25
- Stock
- 1
Product Details
- Series
- 245
- Process
- Leaded
- Diameter
- 0.031" (0.79mm)
- Flux Type
- No-Clean
- Shelf Life
- -
- Wire Gauge
- 20 AWG, 22 SWG
- Composition
- Sn62Pb36Ag2 (62/36/2)
- Part Status
- Active
- Melting Point
- 354°F (179°C)
- Shipping Info
- -
- Form
- Spool, 1 lb (454 g)
- Shelf Life Start
- -
- Type
- Wire Solder
- Storage/Refrigeration Temperature
- 50°F ~ 104°F (10°C ~ 40°C)